General Assembly Information	[ top ]
title	PDF	Size
AN-A006: Mounting Considerations for Packaged Microwave Semiconductors		226k

ESD and Thermal Design	[ top ]
title	PDF	Size
AN-A004R: Electrostatic Discharge Damage and Control		42k
Primer 3, HIGH FREQUENCY TRANSISTOR PRIMER SERIES: Thermal Properties		74k
Primer 3A, HIGH FREQUENCY TRANSISTOR PRIMER SERIES: Thermal Resistance		228k

Chip Use	[ top ]
title	PDF	Size
AN 974: Die Attach and Bonding Techniques for Diodes and Transistors [obsolete]
AN 999: GaAs MMIC Assembly and Handling Guidelines		57k
AN-A005: Transistor Chip Use		406k
AB-0007: INA Bonding Configurations [obsolete]		18k
AN-S009: MODAMP Silicon MMIC Chip Use [obsolete]		196k

Beam Lead Devices	[ top ]
title	PDF	Size
AN 992: Beam Lead Attachment Methods		77k
AN 993: Beam Lead Device Bonding to Soft Substrates		35k
AN 993-1: Thermal Stress Relief in Beam Lead Diode Assembly		24k

General Design Topics	[ top ]
title	PDF	Size
AN-A001: Notes on Choke Network Design		596k
AN-A008: Microwave Oscillator Design		561k
Mathcad Design Worksheets and other design aids can be found in the Design Information section of HPRFhelp